ASML Holding announced on February 27, 2026, that its next-generation High-NA extreme ultraviolet (EUV) lithography tools are now ready for high-volume manufacturing, marking a pivotal advancement for the global semiconductor industry. The Dutch firm, which produces the world’s only commercial EUV systems, confirmed the tools’ technical readiness after achieving critical milestones, including processing 500,000 silicon wafers and reducing production downtime to 20%.
The High-NA EUV machines, priced at $400 million each, enable chipmakers like Intel to streamline complex manufacturing processes, eliminating multiple steps required by older-generation tools. This leap is expected to accelerate production of advanced AI chips needed for applications such as OpenAI’s ChatGPT and meet surging demand for AI hardware. ASML Chief Technology Officer Marco Pieters emphasized the tools’ precision and reliability during a technical conference in San Jose on February 26, stating they are now at a “critical point” for adoption.
While manufacturers must still conduct 2-3 years of testing before full integration, Pieters noted that uptime has reached 80% and is projected to hit 90% by late 2026. The announcement comes as current EUV systems approach their technical limits, underscoring High-NA’s role in sustaining AI innovation and global chip supply chains.
