Chinese researchers have achieved a landmark advancement in semiconductor technology, developing a scalable method to mass-produce high-performance indium selenide chips — a discovery poised to reshape global electronics manufacturing. Published in Science on Friday, the breakthrough addresses critical limitations of silicon-based technology as demand grows for faster, energy-efficient computing solutions.
The ‘Golden Semiconductor’ Revolution
Indium selenide, dubbed the ‘golden semiconductor,’ has long been hindered by production challenges. Maintaining a precise 1:1 atomic ratio of indium and selenium during manufacturing proved elusive until now. Professor Liu Kaihui of Peking University explained: “Our vapor-liquid-solid growth technique creates an ideal environment for crystal formation, ensuring atomic precision at scale.”
From Lab to Factory Floor
The team produced 5-centimeter indium selenide wafers and functional transistor arrays, demonstrating direct applicability in chip manufacturing. Researcher Qiu Chengguang noted the method’s industrial viability, stating it overcomes “the final barrier between theoretical potential and real-world engineering.”
Global Implications
With applications in AI, autonomous vehicles, and smart devices, this innovation positions the Chinese mainland at the forefront of next-gen chip development. As silicon approaches its physical limits, the breakthrough could accelerate global adoption of alternative semiconductors while reducing reliance on traditional supply chains.
